LME Tin to Look for Direction (2017-10-13) 

Following memory and packaging, a new wave of price hikes swept through the semiconductor industry chain. Mature-process wafer foundries in Taiwan, including UMC, Vanguard, and PSMC, were reported to raise quotations as early as April, by as much as 10 or even more. Major users of mature processes—IC design houses led by driver IC makers—were also expected to raise prices in response to rising costs. UMC did not comment on market rumors of price hikes, but the company had previously said that the current pricing environment was "indeed more favorable than before." In a notice, Vanguard said it planned to adjust toll processing prices starting in April 2026, but did not disclose the size of the increase. PSMC confirmed that it had gradually raised prices since the current quarter, mainly for product lines with lower gross margins.

[SMM Tin Morning Briefing: The Most-Traded SHFE Tin Contract Opened Slightly Higher in the Night Session and Then Fluctuated Downward, While Downstream Enterprises Concentrated Their Restocking on Dips]

[SMM Morning Meeting Summary: The Tin Market Weakened After Fluctuating at Highs, Under Short-Term Pressure Amid Intertwined Bullish and Bearish Factors]