The first domestic 1.6Tb/s silicon optical interconnection chip has been developed.

According to the National Information Optoelectronics Innovation Center, recently, (NOEIC) of the State Information Optoelectronics Innovation Center, Pengcheng Laboratory, State key Laboratory of Optical Fiber Communication Technology and Network of China Information and Communication Technology Group, Wuhan Optical Xun Technology Co., Ltd., took the lead in completing the joint development and function verification of 1.6Tb/s silicon-based optical transceiver chip in China, realizing the first leap of China's silicon optical chip technology to the Tb/s level.

The researchers integrated eight channels of high-speed Spark modulator and high-speed photodetector on a single silicon-based optical emitter chip and silicon-based optical receiver chip respectively. Each channel can realize the photoelectric and Spark conversion of high-speed 200Gb/s PAM4 signals. Finally, after chip packaging and system transmission testing, the technical verification of optical interconnection with a monolithic capacity up to 8 × 200Gb/s is completed. This work refreshes the best level of monolithic optical interconnection rate and interconnection density in China, and shows the outstanding advantages of silicon optical technology, such as ultra-high speed, ultra-high density, high scalability and so on. it provides a reliable optical chip solution for broadband interconnection in the next generation data center.

NOEIC has been committed to promoting the technological evolution, domestic first production and industrial transformation of high-end optoelectronic chips. In recent years, continuous breakthroughs have been made in ultra-high-speed optical transceiver chip technology, and a series of new ultra-100Gbaud silicon optical modulators and detectors have been developed.