[Vietnam's FPT Group Establishes Semiconductor Chip Packaging and Testing Facility]
On January 28, Vietnam’s FPT Group announced the establishment of the country’s first locally-owned and operated semiconductor packaging and testing plant. The facility’s Phase 1 (2026–2027) will cover 1,600 m², housing six testing lines and a reliability testing zone, with completion expected by April 30. Phase 2 (2028–2030) plans to expand to about 6,000 m², adding packaging and testing lines to reach an annual capacity in the billions of units, focusing on IoT, automotive, and edge AI chips.