[SMM Tin Express: AI Inference Chips Open Market Space PCB Industry Chain Price Hikes May Continue]

Published: Mar 3, 2026 14:21

Save

Driven by robust demand for AI, the price hikes in the PCB circuit board industry chain continue. According to reports, Japanese semiconductor material giant Resonac has raised the prices of CCL copper clad laminate and adhesive films by 30% starting from March 1. The industry expects that Resonac's price increase will be passed on to high-end manufacturing processes such as MLCC, HDI boards, IC substrates, and high-frequency high-speed PCBs.

Moreover, the PCB sector may see a super catalyst – Nvidia's LPU inference chip. The market believes that with the implementation and rapid growth of AI applications, the market for specialized AI inference chips will expand rapidly, bringing about a significant impact on the PCB industry including increased volume and prices, process upgrades, material innovations, and higher concentration. This will enhance the value and importance of PCBs in AI chips, opening up new market size opportunities for the PCB industry.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM‘s internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or to learn more information, please contact: lemonzhao@smm.cn

For more information on how to access our research reports, please contact:service.en@smm.cn

Related News

Mar 6, 2026 15:55

[SMM Tin Flash: Global Smartphone Shipments in 2026 Are Expected to Decline by About 7% YoY]

According to market forecasts, global smartphone shipments in 2026 are expected to decline by about 7% YoY. This forecast is based on memory price assumptions for Q1 2026, and it is expected that, over time, price pressure and tight supply will begin to ease somewhat in H2 this year. In 2026, the global smartphone market will face significant challenges. Tightening memory supply and persistently high prices have continued to increase cost pressure on producers. At present, memory’s share in the smartphone bill of materials (BOM) has risen markedly, eroding producers’ profitability, with a more pronounced impact on entry-level devices. Since Q4 2025, smartphone producers have begun raising retail prices to maintain margins. However, continued price increases may weaken market demand, especially in price-sensitive emerging markets.

Mar 6, 2026 15:55

Mar 6, 2026 15:40

Data: SHFE, DCE market movement (Mar 06)

The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 06 Mar , 2026

Mar 6, 2026 15:40

Mar 6, 2026 12:04

Center of the Most-Traded SHFE Tin Contract Shifted Higher, Only a Small Number of Rigid-Demand Deals Were Concluded in the Spot Market in the Morning [SMM Tin Midday Review]

[SMM Tin Midday Review: The Center of the Most-Traded SHFE Tin Contract Moved Higher; Only a Small Volume of Rigid-Demand Transactions Were Concluded in the Spot Market This Morning]

Mar 6, 2026 12:04