[Applied Materials releases series of 3D manufacturing equipment for AI chips targeting HBM stacking process]

Published: Jun 30, 2026 11:36
Applied Materials unveiled a product line of three-dimensional (3D) chip manufacturing equipment for AI semiconductors. The series primarily focuses on planarization, deposition, and metrology and inspection required for advanced packaging processes such as high-bandwidth memory (HBM), chiplets, and hybrid bonding. Specifically, the equipment announced this time includes advanced chemical mechanical polishing (CMP), electrochemical deposition (ECD), and plasma-enhanced chemical vapor deposition (PECVD) systems for packaging, among others, while also adding electron-beam-based process control equipment and upgrading its epitaxial equipment for DRAM processes.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM's internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or for more information, please contact: lemonzhao@smm.cn
For more information on how to access our research reports, please contact:service.en@smm.cn