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Desay SV, SemiDrive deepen collaboration to drive local innovation in AI cockpit solutions

iconApr 27, 2025 18:07
Source:gasgoo
Together, they will co-develop a new-generation AI cockpit platform, aiming to drive forward local technological innovation in the era of AI-powered vehicle interiors.

Shanghai (Gagsoo)- On April 27, during the AUTO SHANGHAI 2025, Desay SV and SemiDrive announced an upgraded partnership, committing to the joint development of full-chain integrated solutions spanning from smart cockpits to vehicle zone control units (ZCUs).

Together, they will co-develop a new-generation AI cockpit platform, aiming to drive forward local technological innovation in the era of AI-powered vehicle interiors.

The enhanced collaboration will further focus on the functional integration of cockpit and body domains, with the goal of significantly advancing decision-making and execution capabilities in next-generation smart vehicles, thereby delivering safer, smarter, and more personalized driving experiences.

Desay SV has long been a key player in smart cockpit systems, assisted driving, and connected services, while SemiDrive stands as a leading provider of full-scenario intelligent automotive chips in China. Building on SemiDrive's next-generation AI cockpit processor X10, the two companies plan to redefine human-vehicle interaction paradigms with a forward-looking approach, enabling vehicles to more accurately understand and predict user intentions for a deeply immersive, intelligent, and customized in-car experience.

The X10 series from SemiDrive is built on the AI-optimized ARMv9.2 CPU architecture, achieving CPU performance of up to 200K DMIPS. It integrates an 1,800 GFLOPS GPU and a 40 TOPS NPU, along with a 128-bit LPDDR5X memory interface operating at speeds of 9600 MT/s, providing a massive system bandwidth of 154 GB/s to support the most demanding computational needs.

Against the backdrop of transformative changes in automotive electronic and electrical architectures, Desay SV introduced its EEA4.0 vehicle-road-cloud integrated architecture at the AUTO SHANGHAI 2025. This innovative platform, based on high-performance multi-domain fusion solutions, moves beyond simple technological aggregation by standardizing data and dynamically sharing computing resources. Through collaborations with automakers, chipmakers, and algorithm developers, it systematically boosts the efficiency of driver assistance system development and application.

In addition to cockpit innovations, Desay SV and SemiDrive announced plans to jointly develop a localized ZCU platform based on SemiDrive's E3119/E3118 and E3650 chips.

The E3119/E3118 series, built on ARM Cortex R5F CPUs, supports two independent 400MHz high-performance cores and a separate cybersecurity core, along with nearly 2MB of large-capacity SRAM, rich peripherals, and IO resources, catering to vehicle IO-type ZCUs and body domain controllers.

Meanwhile, the E3650, specifically designed for ZCU applications, features the latest ARM Cortex R52+ high-performance lockstep multicore cluster with speeds up to 600MHz. It integrates up to 16MB of embedded non-volatile memory and offers superior real-time performance and computing power. Its highly integrated peripherals and industry-leading GPIO configurations significantly simplify system design and enable substantial cost optimization, supporting the evolution of next-generation electronic and electrical architecture.

Through this upgraded partnership, Desay SV and SemiDrive are pooling their strengths to tackle key technological challenges across AI cockpits and vehicle zone controllers. Their end-to-end integrated solution, from chip to application, is set not only to accelerate the local development and deployment of high-performance AI cockpits but also to offer global automakers a more competitive set of technology options.

For queries, please contact Lemon Zhao at lemonzhao@smm.cn

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