SUMCO Halts New Plant Project, Adjusts Subsidy & Focuses on Tech Upgrade

Published: Mar 31, 2026 11:56

Save

SUMCO, a major global silicon wafer manufacturer based in Japan, recently announced adjustments to its capacity expansion plans, putting its new plant project on hold and focusing resources on upgrading existing facilities and conducting R&D on advanced process technologies. It is understood that following this adjustment, the related subsidy amount SUMCO receives from Japan’s Ministry of Economy, Trade and Industry has been reduced from the originally planned 75 billion yuan to 19.3 billion yuan. The company stated that it will focus its development efforts on technological upgrades and capacity optimization at existing plants in places including Imari City, Saga Prefecture, while giving priority to advancing R&D on silicon wafer technologies suited to cutting-edge chip manufacturing processes and increasing capacity.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM‘s internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or to learn more information, please contact: lemonzhao@smm.cn

For more information on how to access our research reports, please contact:service.en@smm.cn

Related News

45 mins ago

[SMM Tin Flash: China’s PCB Industry Investment in 2025 Was up About 3% YoY, with AI Computing Power PCBs Becoming the Core Growth Engine]

According to the latest statistics from CINNO•ICResearch, total investment in China’s PCB industry reached approximately 105.3 billion yuan in 2025, up 2.9% YoY from 2024. Although the number of investment projects in China’s PCB industry pulled back in 2025 compared with 2024, investment size per project increased significantly, with the largest single investment also rising accordingly. The investment landscape became more concentrated in the high-end segment, with an optimized structure. PCBs dedicated to AI computing power became the clear main theme, with key investment flowing into high-end products such as advanced HDI, high-layer-count boards, and high-speed, high-frequency boards; automotive electronics PCBs followed closely behind and posted strong growth, benefiting from upgrades in NEVs and intelligent driving; communications and industrial control PCBs provided steady support for 5G and data center construction. Overall, the industry moved away from the low and mid-end fragmented layout of 2024 and officially entered a new stage led by the high-end segment.

45 mins ago

1 hour ago

The most-traded SHFE tin contract surged sharply late in the night session and closed at a high level, downstream enterprises showed weak purchase willingness [SMM Tin Morning Brief]

[SMM Tin Morning Brief: The Most-Traded SHFE Tin Contract Surged Sharply Late in the Night Session and Closed at a High, While Downstream Enterprises Showed Weak Purchase Willingness]

1 hour ago

18 hours ago

Data: SHFE, DCE market movement (Mar 31)

The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 31 Mar , 2026

18 hours ago