Jingsheng Electromechanical Achieves Breakthroughs in Localization of 8-12 Inch Semiconductor Equipment

**Jingsheng Electromechanical: Gradually Achieving Breakthroughs in the Localization of 8-12 Inch Semiconductor Large Silicon Wafer Equipment**

SMM Nov 4th news - Jingsheng Electromechanical stated during a teleconference that in the field of semiconductor equipment, the company has gradually achieved breakthroughs in the localization of 8-12 inch semiconductor large silicon wafer equipment, with related products achieving batch sales. Against the backdrop of the continued recovery of the semiconductor industry, the company's original market for 8-12 inch large silicon wafer equipment has further expanded. It has also rapidly achieved market breakthroughs in power semiconductor equipment and advanced process equipment. The company's 8-inch silicon carbide epitaxial equipment and optical measurement equipment have been successfully sold. The 12-inch three-axis thinning and polishing machine has been extended to leading domestic packaging customers. The 12-inch silicon reduced-pressure epitaxial growth equipment has been shipped and new customers have been expanded, with related equipment orders continuously growing.