US Fed's October meeting rate hike expectations heat up, most-traded SHFE tin contract continues to decline in night session [SMM Tin Morning Meeting Summary]

Published: Oct 15, 2026 08:58 (GMT+8)
[SMM Tin Morning Meeting Summary: US Fed October Meeting Rate Hike Expectations Rise, Most-Traded SHFE Tin Contract Continues Downward in Night Session]

SMM Tin Morning Brief | US Fed October Meeting Rate Hike Expectations Rise, Most-Traded SHFE Tin Contract Falls in Night Session — October 15, 2026 (Thursday)

[Futures]

The most-traded SHFE tin SN2611 contract closed at 372,820 yuan/mt in the night session, down 13,090 yuan or 3.39% from the previous settlement of 385,910,with a night session range of 374,990–378,380, a low of 371,200, and trading volume of 95,800 lots.

LME 3M closed at $50,446/mt, down $1,321 or 2.55%, while the LME official 3-month Closing Price stood at $51,767/mt, down 2.71%.

[Inventory]

  • LME tin inventory on 10/14 was 4,250 mt, up 35 mt from 4,215 mt the previous day; live warrants at 3,275 mt and cancelled at 905 mt.
  • SHFE tin futures warrants on 10/14 were 3,536 mt, down 70 mt from the previous day (Shanghai 708, Guangdong 2,704, Jiangsu 124 mt).
  • SMM's latest weekly report on China tin ingot social inventory showed 8,750 mt, a mild post-holiday inventory buildup of +117 mt from 9/30, with absolute levels still in the lower range for the year.

[Macro] US Fed October meeting rate hike expectations have risen, with CME FedWatch showing the probability of a 25bp hike in October at recent-month highs. The Cleveland Fed released hawkish remarks, the US dollar DXY >102, and US Treasury yields fluctuated at highs, pressuring valuations of high-beta assets. The Philadelphia Semiconductor Index fell 2.67% intraday, and the pullback in AI computing chain sentiment directly transmitted to tin demand expectations. Middle East tensions remained volatile, and OPEC+ production cuts underpinned oil prices at highs, providing a floor for tin rather than a boost.

[Fundamentals] Ore supply: Myanmar Wa State production resumptions remained slower than expected, recovering to 40–50%; the rainy season and explosives controls continued to disrupt tin concentrate imports; Indonesia's export quotas/policies remained uncertain; DRC geopolitical risks still had marginal impact on LME. Smelting: Tin Co. began routine maintenance from 9/30 for no more than 45 days; refined tin operating rates in Yunnan and Jiangxi provinces pulled back to a low level of 29.74%. Demand: SMM China tin solder enterprise operating rate was 72.8% in August (flat in the off-season); it rose to 79.1% in September (+5% YoY). High-end solder for AI servers and advanced packaging maintained resilience, while traditional consumer electronics and home appliance tin solder orders saw limited recovery, with the September peak season falling short of expectations. Imports: Tin ore imports in August were 19,300 mt, up 14% MoM and 88% YoY.

[Spot Market] After SHFE tin fell sharply on 10/14, downstream inquiries were relatively active in the morning with transactions at low prices; in the afternoon, futures accelerated their decline, and suppliers held back from selling, keeping quotes at premiums.

 

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM's internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or for more information, please contact: lemonzhao@smm.cn
For more information on how to access our research reports, please contact:service.en@smm.cn
Related News
[AI memory supercycle squeezes smartphone brands as Q3 shipments fall 20%]
4 mins ago
[AI memory supercycle squeezes smartphone brands as Q3 shipments fall 20%]
Read More
[AI memory supercycle squeezes smartphone brands as Q3 shipments fall 20%]
[AI memory supercycle squeezes smartphone brands as Q3 shipments fall 20%]
AI servers are absorbing global memory supply, inflating smartphone costs. Counterpoint Research data show Q3 global handset shipments fell about 20% y-o-y, the weakest Q3 since 2012, with retail prices up 20%. Samsung raised Galaxy S26 prices on Oct. 1, seven months after launch, lifting the 256GB model by 150,000 won (111 USD) to 1.404 million won; Apple also raised iPhone 18 Pro prices. Chipmakers are shifting capacity to HBM and server DRAM, lifting NAND prices; TrendForce expects handset DRAM prices to rise 8-13% in Q3. Xiaomi's Q3 shipments fell over 30%, Oppo and Vivo over 20%; Samsung led with 23%. It cuts both ways for Samsung: its DS chip arm gains, while the DX division posted an 800 billion won (590 million USD) Q2 loss; Hana Securities sees a 2.1 trillion won (1.56 billion USD) Q3 loss.
4 mins ago
[GlobalFoundries to build new New York fab worth up to 21 billion USD; Renesas to procure output, Tokyo Electron to supply tools]
4 mins ago
[GlobalFoundries to build new New York fab worth up to 21 billion USD; Renesas to procure output, Tokyo Electron to supply tools]
Read More
[GlobalFoundries to build new New York fab worth up to 21 billion USD; Renesas to procure output, Tokyo Electron to supply tools]
[GlobalFoundries to build new New York fab worth up to 21 billion USD; Renesas to procure output, Tokyo Electron to supply tools]
GlobalFoundries (GF) will build a new semiconductor fab in New York State, with project scale of up to about 21 billion USD (roughly 3.32 trillion yen). The project sits under the U.S.-bound investment framework agreed by Japan and the U.S. in tariff talks. Renesas Electronics will be procurement partner for the plant's output, while Tokyo Electron supplies equipment. The fab will make chips for automotive, industrial and communications infrastructure. With advanced production concentrated in Taiwan and South Korea, the project aims to strengthen Japan-U.S. supply chains against geopolitical risks; for Japan it also diversifies disaster risk after the July Kumamoto earthquake halted Kyushu plants. It is the third tranche of the 550 billion USD commitment made in July 2025; six projects worth 109 billion USD, about 20%, have been agreed.
4 mins ago
[SEMI: global 300mm fab equipment spending to reach 227 billion USD by 2029]
17 hours ago
[SEMI: global 300mm fab equipment spending to reach 227 billion USD by 2029]
Read More
[SEMI: global 300mm fab equipment spending to reach 227 billion USD by 2029]
[SEMI: global 300mm fab equipment spending to reach 227 billion USD by 2029]
Global 300mm semiconductor fab equipment spending is forecast to reach 227 billion USD by 2029, driven by AI chips, high-performance computing and advanced manufacturing, according to SEMI. Equipment investment will jump 31% year on year to 149 billion USD in 2026, with double-digit growth seen through 2029. Capacity build-out is accelerating: 20 new 300mm fabs or lines are expected to start construction worldwide in 2026, plus 18 in 2027, excluding R&D-only sites. Construction spending will rise 23% to 47.5 billion USD in 2026, a further 33% to 63.3 billion USD in 2027 and 68.4 billion USD in 2028. The Americas lead growth, with regional equipment spending more than doubling from 18.1 billion USD in 2026 to 40.6 billion USD in 2029; the US starts three new fabs in 2026 and four in 2027. Thirteen new fabs or lines will begin operations or ship first silicon in 2026, rising to 23 in 2027. SEMI CEO Ajit Manocha said demand is translating into physical manufacturing expansion. The 300mm Fab Outlook adds 166 updates covering 163 fabs and lines.
17 hours ago
Register to Continue Reading
Gain access to the latest insights in metals and new energy
Already have an account?Sign in here
US Fed's October meeting rate hike expectations heat up, most-traded SHFE tin contract continues to decline in night session [SMM Tin Morning Meeting Summary] - Shanghai Metals Market (SMM)