Mitsui Kinzoku Plans New Malaysia Copper Foil Plant as AI Demand Drives Further Expansion

Published: Aug 18, 2026 09:45
Mitsui Kinzoku plans to build a new copper foil plant in Malaysia to meet rapidly growing demand from AI infrastructure and advanced semiconductors. The new facility is targeted to start operations from 2031 with monthly capacity of 1,200 tonnes of VSP high-frequency copper foil and 4 million m² of MicroThin ultra-thin copper foil. The project would lift total VSP capacity to 2,600 tonnes/month, while Mitsui Kinzoku is also studying a further expansion toward 5,000 tonnes/month.

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