[SMMSn News: ASML Is Expected to Expand Chipmaking Equipment into Advanced Packaging]

Published: Mar 03, 2026 14:12 (GMT+8)

Save

It is reported that ASML is expected to use artificial intelligence to enhance tool performance and production speed, expand chip manufacturing equipment into the advanced packaging field, and develop tools to help join multiple chips together.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM's internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or for more information, please contact: lemonzhao@smm.cn

For more information on how to access our research reports, please contact:service.en@smm.cn

Related News

4 hours ago

[Mingyi Electronics Launches High-Aspect-Ratio Gantry Line Electroplating Equipment for AI Servers and IC Substrates]

According to Sanfu New Materials, Mingyi Electronics under Sanfu New Materials has launched a new product series—high-aspect-ratio gantry line electroplating equipment, capable of supporting the production of boards with aspect ratios of 40:1 and above. This series of equipment can be customized according to client needs, is compatible with phosphorized copper balls and insoluble anode systems, and can meet the electroplating requirements for high-end circuit boards such as high-aspect-ratio AI server PCB boards and IC substrates. The equipment has passed various technical tests and has gained recognition from leading server PCB manufacturing clients in China. Multiple equipment orders are already in hand, and the production lines for this series of equipment have entered the production and delivery stage.

4 hours ago

7 hours ago

Data: SHFE, DCE market movement (Oct 16)

The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 16 Oct , 2026

7 hours ago

11 hours ago

[SMM Tin Midday Review] Rate Hike Expectations Pull Back and Futures Recover, SHFE Tin Returns to the 380,000 Yuan Mark

[SMM Tin Midday Review: Rate Hike Expectations Pull Back and Futures Recover, SHFE Tin Returns to the 380,000 Yuan Mark]

11 hours ago