[SMM Tin Express: Lens Technology Achieves Mass Shipments of SSD Solid State Drives]

The following table shows the ferrous and nonferrous metals movement on the SHFE and DCE on 03 Mar , 2026

On the afternoon of March 3, the most-traded SHFE tin contract fell rapidly, hitting the 12% daily limit down near the close to settle at 394,890 yuan/mt. Recently, fading macro sentiment combined with rising expectations of an overseas supply recovery led to a swift unwinding of the sentiment premium previously injected by geopolitical conflicts. Market pessimism was released in a concentrated manner. Futures have remained weak since the night session yesterday, with losses continuing to widen during the day, ultimately hitting the limit down.

Driven by robust demand for AI, the price hikes in the PCB circuit board industry chain continue. According to reports, Japanese semiconductor material giant Resonac has raised the prices of CCL copper clad laminate and adhesive films by 30% starting from March 1. The industry expects that Resonac's price increase will be passed on to high-end manufacturing processes such as MLCC, HDI boards, IC substrates, and high-frequency high-speed PCBs. Moreover, the PCB sector may see a super catalyst – Nvidia's LPU inference chip. The market believes that with the implementation and rapid growth of AI applications, the market for specialized AI inference chips will expand rapidly, bringing about a significant impact on the PCB industry including increased volume and prices, process upgrades, material innovations, and higher concentration. This will enhance the value and importance of PCBs in AI chips, opening up new market size opportunities for the PCB industry.