Apple Plans to Introduce TSMC's SoIC Advanced Packaging Process into M5 Chips"
TSMC's 2nm process is rumored to enter trial production this week. In addition to Apple securing the first wave of capacity in 2025, the next-generation 3D advanced packaging platform SoIC (System-on-Integrated-Chip) is also planned to be introduced and mass-produced in M5 chips. It is expected that the SoIC capacity will increase by several times in 2026.


