Beijing (Gasgoo)- On March 21, SemiDrive announced the release of its newest automotive-grade MCU products, the E3119F8/E3118F4, targeting applications such as vehicle body domain control, domain controllers, front-view integrated systems, and LiDAR, further enhancing the layout of SemiDrive's E3 series high-performance MCU products.
As a leading developer of comprehensive intelligent vehicle chip solutions, SemiDrive's products cover intelligent cockpits, smart controls, and intelligent driving. The E3 series high-performance MCUs, introduced in 2022, have been widely deployed in electric drive system, BMS battery management, chassis, steering, ADAS, and other core domain control areas, with shipments exceeding millions of units so far.
The E3119F8/E3118F4 represents the latest addition to the E3 series MCU. Featuring an ARM Cortex R5F CPU, it can support up to two independent 400MHz high-performance application cores, with the security core reaching a maximum frequency of 200MHz.
With close to 2MB of large-capacity SRAM and support for both 8MB and 4MB Flash storage configurations, these MCUs are designed for compact ECUs, featuring a small 13x13mm package size and support for signal fan-out on 4-layer PCBs, offering more available IOs than traditional LQFP176 packages while enabling chip miniaturization.
Several automakers, intelligent driving tech companies, LiDAR and battery manufacturers have already initiated development based on the E3119F8/E3118F4, with mass production slated for the second half of 2024.
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