Samsung Electronics has reportedly reorganized its team and set up a new HBM chip R&D team.

According to industry sources, Samsung Electronics' Device Solutions (DS) division, which is responsible for the semiconductor business, underwent a restructuring on the same day and established a new HBM R&D team. Sun Yong-soo, vice president of Samsung Electronics and an expert in high-performance DRAM design, will serve as the head of the R&D team and lead the team to focus on the development of HBM3, HBM3E, and the new generation of HBM4 technology. In addition, Samsung Electronics has also reorganized its advanced packaging (AVP) team and equipment technology laboratory to enhance its overall technological competitiveness.