TSMC is Fully Expanding its CoWoS Production Capacity to Meet the High Demand in the Advanced Packaging Field

Media reports said that TSMC is fully expanding its CoWoS production capacity and has found a construction site for an advanced packaging factory in the Huwei Park in Yunlin County, Taiwan. AI semiconductors are currently the focus of the global chip market, and giants such as NVIDIA have paired their AI computing chips with HBM memory. In the integration and packaging process of computing chips and HBM, TSMC's CoWoS technology has the highest maturity and has become the mainstream choice.