Jiangfeng Electronics: the company's target products can be used in the production of the third generation semiconductors and IGBT chips.

Jiangfeng Electronics said on the investor interactive platform on November 25th that the company's target products can be used in the production of third-generation semiconductors and IGBT chips.

Data show that Jiangfeng Electronics is engaged in the R & D, production and sales of high purity sputtering targets. Its main products include aluminum targets, titanium targets and titanium rings, tantalum targets and tantalum rings. Its R & D and production of ultra-high purity metal sputtering targets fill the gap in China in this field, end the history of product dependence on imports, meet the expanding market demand of domestic enterprises, and successfully obtain the certification of international first-class chip manufacturers. batch application in the global cutting-edge technology in the field of ultra-large-scale integrated circuit manufacturing has become a Chinese force successfully participating in the international market competition in the field of electronic materials.

In 2015, the company was rated as "National intellectual property advantage Enterprise" by the State intellectual property Office, and won the honor of "first prize of technological invention in Zhejiang Province". In 2019, the company ranked 74th in the Top 500 Chinese Enterprise Patent list, and won the honor of "performance Evaluation of Zhejiang Patent Project (Patent Gold Award)".

Relying on the leading technical strength and high-level technical team, Jiangfeng has successively undertaken or presided over a number of national research projects, such as "863 Program key Project", "863 Plan guidance Project", "02 Project" and so on.

In addition, with technological innovation breakthroughs and iterations, the flat panel display industry chain accelerates the migration to mainland China, and its market scale is expected to grow. On April 9 this year, Jiangfeng Electronics plans to issue convertible bonds to raise more than 500 million yuan. After deducting the issuance fee, the company plans to spend 119 million yuan on the construction project of high-purity metal targets and components for flat panel display in Huizhou base, and 246 million yuan on the construction project of high-purity metal targets and components for flat panel display in Wuhan base.

Jiangfeng Electronics said that the implementation of the convertible bond investment project will supply targets and machine-related components to flat panel display manufacturers nearby, which will help the company to further expand the production capacity and market share of high-purity metal sputtering targets and related machine components for flat panel display, and enhance the company's profitability and comprehensive competitiveness.