On the evening of August 2, Shennan Circuit announced that it was proposed to raise no more than 2.55 billion yuan for the manufacturing project of IC carrier products for high-end flip chips and supplementary liquidity.
It is reported that Shennan Circuit is currently mainly engaged in three businesses: printed circuit boards, packaging substrates and electronic assembly. Among them, the manufacturing project of IC carrier products for high-end flip chips is to further enhance the production capacity and technical capability of the company's packaging substrate business, and the supplementary liquidity project is to meet the capital needs of the rapid development of the company's business, and these projects are carried out around the company's main business.
Shennan Circuit said that through this non-public offering, it will further improve its capital strength, and it is an important strategic measure for the company to maintain sustainable development and consolidate its leading position in the industry, which can not only enhance the company's production capacity and meet the growth needs of the future market, but also actively respond to the national industrial policy, laying a solid foundation for the company to effectively reduce operational risks and expand market share. It provides a strong guarantee to further enhance the competitiveness of the market.
In recent years, with the continuous expansion of the production and operation scale of Shennan circuit and the continuous launch of new production capacity, Shennan circuit has invested a lot of its own funds for production line construction and innovative research and development. By the end of 2020, the asset-liability ratio of the company's consolidated statement was 46.86%. Through this non-public offering, it will help Shennan Electric to enhance its capital strength, optimize its asset-liability structure, and reduce financial expenses.
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