[SEMI: The Chip Industry Needs to Develop More Unified Standards for Backend Processes Such as Packaging and Testing]
Jim Hamajima, President of SEMI (Semiconductor Equipment and Materials International) Japan Office, said that backend processes, including chip packaging and testing, are more fragmented compared to the early stages of chip manufacturing, which may affect the profit level of the industry. He believes that the chip industry needs to develop more international standards for backend or later production processes to enable companies such as Intel and TSMC to increase production capacity more effectively.
