Wafer Prices Fall Under Pressure Again as Cost Drag Weakens and Inventory Drawdown Continues, Module Prices Expected to Stop Falling [SMM Weekly Review]
[SMM Weekly Review: Wafer Prices Fall Under Pressure Again, Cost Drag Weakens and Inventory Drawdown Accelerates, Module Prices Expected to Stop Falling] This week's module market changes were concentrated at both ends—individual specifications saw supplementary price cuts while inventory drawdown accelerated. On the distributed side, 182mm and HJT modules were each lowered by 0.0025 yuan/W, while all other specifications remained stable, and guidance prices were still not adjusted. On the centralized side, the three-tier quotes remained flat for the second consecutive week, with downward pressure further narrowing to individual specifications. As of now, the average price of domestic Topcon modules-182mm (distributed) is 0.6995 yuan/W; Topcon modules-210mm (distributed) average 0.718 yuan/W; Topcon modules-210R (distributed) average 0.7145 yuan/W; Topcon modules-210R high power (distributed) average 0.754 yuan/W; BC modules-210R (distributed) average 0.763 yuan/W; HJT modules-210mm (distributed) average 0.721 yuan/W. On the centralized side, 182 modules are priced at 0.691 yuan/W, 210 modules at 0.702 yuan/W, and 210R modules at 0.697 yuan/W.