[SMM Tin Flash: SK Hynix Steps Up Its US HBM Expansion, $4 Billion Plant Officially Breaks Ground]

Published: Aug 28, 2026 09:11

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SK Hynix (SKHY.O) held a groundbreaking ceremony on Thursday for its advanced memory packaging plant in Indiana, US. The plant in West Lafayette, with an investment of more than $4 billion and covering 133.5 acres, will become SK Hynix’s first high-bandwidth memory (HBM) packaging base in the US. SK Hynix CEO Guo Lu said at the event that the plant’s cleanroom is expected to come online by October 2028, and mass production of next-generation HBM is planned to begin in H2 2029. Once fully operational, the plant will become an important HBM production hub and is expected to employ about 1,000 people.

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