[SK Hynix and SanDisk Release First Standard Specification for HBF]

Published: Aug 4, 2026 14:44

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SK Hynix announced on the 4th that it has jointly released the first standard specification for the next-generation memory technology High Bandwidth Flash (HBF) with SanDisk. It is reported that this standard specification is the first outcome achieved over approximately six months, following SK Hynix's initiation of HBF standardization collaboration with SanDisk in August last year and the establishment of an alliance in February this year. The specification defines two capacity configurations, utilizing 8-layer and 16-layer NAND chip stacking respectively, supporting a maximum capacity of 512GB. It also sets bandwidth standards across three tiers (Grade 1 to 3), with data transfer capabilities ranging approximately from 0.4TB/s to 3TB/s.

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