[Applied Materials releases series of 3D manufacturing equipment for AI chips targeting HBM stacking process]

Published: Jun 30, 2026 11:36
Applied Materials unveiled a product line of three-dimensional (3D) chip manufacturing equipment for AI semiconductors. The series primarily focuses on planarization, deposition, and metrology and inspection required for advanced packaging processes such as high-bandwidth memory (HBM), chiplets, and hybrid bonding. Specifically, the equipment announced this time includes advanced chemical mechanical polishing (CMP), electrochemical deposition (ECD), and plasma-enhanced chemical vapor deposition (PECVD) systems for packaging, among others, while also adding electron-beam-based process control equipment and upgrading its epitaxial equipment for DRAM processes.

Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market communication, and relying on SMM's internal database model. They are for reference only and do not constitute decision-making recommendations.

For any inquiries or for more information, please contact: lemonzhao@smm.cn
For more information on how to access our research reports, please contact:service.en@smm.cn
Related News
Metals showed mixed performance; lithium carbonate rose nearly 5%, SHFE aluminum and SHFE nickel led the decline, and SHFE gold, SHFE silver, and platinum dropped over 2% [SMM Midday Commentary]
13 mins ago
Metals showed mixed performance; lithium carbonate rose nearly 5%, SHFE aluminum and SHFE nickel led the decline, and SHFE gold, SHFE silver, and platinum dropped over 2% [SMM Midday Commentary]
Read More
Metals showed mixed performance; lithium carbonate rose nearly 5%, SHFE aluminum and SHFE nickel led the decline, and SHFE gold, SHFE silver, and platinum dropped over 2% [SMM Midday Commentary]
Metals showed mixed performance; lithium carbonate rose nearly 5%, SHFE aluminum and SHFE nickel led the decline, and SHFE gold, SHFE silver, and platinum dropped over 2% [SMM Midday Commentary]
13 mins ago
Shanghai Spot Copper Premiums Remain Under Pressure amid Weak Month-End Consumption [SMM Shanghai Spot Copper]
48 mins ago
Shanghai Spot Copper Premiums Remain Under Pressure amid Weak Month-End Consumption [SMM Shanghai Spot Copper]
Read More
Shanghai Spot Copper Premiums Remain Under Pressure amid Weak Month-End Consumption [SMM Shanghai Spot Copper]
Shanghai Spot Copper Premiums Remain Under Pressure amid Weak Month-End Consumption [SMM Shanghai Spot Copper]
[SMM Shanghai spot copper] Looking ahead to tomorrow, today was the last trading day of the month, and downstream procurement sentiment continued to pull back. End-user demand was weak, and transactions remained sluggish even after suppliers modestly lowered their offer prices, leaving the overall market quiet on both the buying and selling sides. However, some cargoes with invoices dated this month still managed to transact due to invoice-related demand, indicating structural support. As a new monthly procurement cycle begins and copper prices hover at relatively low levels, downstream restocking demand is expected to be released, and consumption is likely to recover marginally. When that happens, buying and selling sentiment may be boosted, and spot discounts are likely to gradually narrow.
48 mins ago
Futures plunged again, spot market improved mildly [SMM South China Spot Aluminum Daily Review]
1 hour ago
Futures plunged again, spot market improved mildly [SMM South China Spot Aluminum Daily Review]
Read More
Futures plunged again, spot market improved mildly [SMM South China Spot Aluminum Daily Review]
Futures plunged again, spot market improved mildly [SMM South China Spot Aluminum Daily Review]
1 hour ago