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Founded in February 2022, Rsemi specializes in automotive chip design, focusing on the development and sales of automotive electronic chips, software services, and modular solutions. Leveraging its deep expertise in high-speed signal chain design, low-power architecture, and system-level verification, the company has launched a self-developed automotive SerDes chip series covering the entire high-speed interconnect chain—from sensors to intelligent driving domains and from cockpit systems to displays.
Rsemi’s R-LinC chip series adopts an advanced 22nm automotive-grade process, achieving single-channel data rates of up to 16 Gbps. The chips deliver high bandwidth, low latency, strong anti-interference, and high reliability. Their aggregated forwarding architecture and system-level cost optimization design effectively reduce the number of SerDes chips required, helping automakers achieve an optimal balance of functionality, performance, and cost. The products have already been adopted by several major OEMs and Tier-1 suppliers.
Globally, the automotive SerDes chip market is dominated by Analog Devices (Maxim), Texas Instruments, Inova Semiconductors, Sony Semiconductor, and ROHM Semiconductor, which together hold about 97% of the market share.
With the rapid adoption of intelligent driving and smart cockpit systems, the number of in-vehicle cameras and displays is rising, driving strong demand for high-speed data transmission chips. According to QYResearch, the global automotive SerDes chip market was valued at approximately US$554 million in 2024 and is expected to reach 1.983 billion dollar by 2031, representing a compound annual growth rate (CAGR) of 20.3% from 2025 to 2031. China is the largest market, accounting for about 30% of global demand.
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