Shanghai (Gasgoo)- On August 28, Black Sesame Technologies, a Chinese leading developer of automotive-grade computing chips, entered into a strategic partnership with DEEP Robotics, a pioneer in embodied intelligence and robotics applications, according to a post on the former's WeChat account.
The two companies will collaborate on developing control platforms for embodied AI, building industry-specific intelligent solutions, and expanding into global markets. Their joint efforts aim to accelerate the deployment and innovation of high-performance robots across a wide range of industries.
Black Sesame Technologies will contribute its self-developed, high-performance automotive-grade chips as the foundation for collaboration, integrating with DEEP Robotics' platform to design solutions for embodied intelligence. The companies plan to target applications such as vessel inspection, smart construction, and research and education, while simultaneously advancing their presence in overseas markets.
Shan Jizhang, founder and CEO of Black Sesame Technologies, said the partnership will combine the company's advanced chip technology with DEEP Robotics' platform capabilities to enhance perception, decision-making, and control in robotics. He described the collaboration as both a technological integration and a key step in building a strategic presence in the global robotics market, with the goal of accelerating real-world adoption of embodied AI and delivering better solutions to customers worldwide.
Zhu Qiuguo, founder and CEO of DEEP Robotics, emphasized that the company's focus has always been on advancing intelligent robotics and practical applications. He said the alliance with Black Sesame Technologies will speed up the intelligent evolution of its platform, particularly in complex use cases such as maritime inspection and smart construction.
The partnership, built on joint R&D and market alignment, will focus on refining embodied AI control platforms through real-world applications. Both companies see the initiative as a way to strengthen domestic innovation in robotics and semiconductor technologies, while simultaneously advancing their international expansion strategies.
