SMM reported on July 22: According to information from the National Intellectual Property Administration, Shanghai Huali Integrated Circuit Manufacturing Co., Ltd. has developed a method for protecting the metal interface at the bottom of vias in copper wire interconnection processes, optimizing the copper interconnection step in semiconductor manufacturing. As a critical step in advanced process chips, this process optimization enhances chip performance and reliability, reflecting China's progress in the semiconductor materials field and indirectly promoting the application of high-end copper wire and cable in electronic manufacturing.
Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly available information, market exchanges, and relying on SMM's internal database model, for reference only and do not constitute decision-making recommendations.