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NEVC said it has built a "4+2" business framework for its automotive chip division, integrating four core pillars—standard research, testing and evaluation, product certification, and automotive-grade management—alongside two technical service systems: an application verification framework and a quality management system specifically for automotive-grade chips. Built on a 22nm process and supporting data rates up to 12Gbps, the chips are designed with pin-to-pin compatibility and offer competitive performance as a cost-efficient alternative to international peers.
Backed by China's State Administration for Market Regulation's key laboratory for automotive chip testing and evaluation and the China Automotive Chip Industry Innovation Strategic Alliance, NEVC offers services for chip testing, certification, and quality management. While MeriTech specializes in high-performance analog signal chain front-end and high-speed interface chips, with applications spanning connected vehicles, low-altitude economy, robotics, and industrial sectors. Its key products include automotive SerDes (serializer/deserializer) chips, high-performance ADC/DAC converters, and LiDAR front-end chips.
NEVC and MeriTech have long maintained cooperation in reliability testing, functional safety certification, and client engagement for automotive-grade chips. The new strategic agreement aims to deepen collaboration and drive innovation across service models and business domains.
Notably, MeriTech's three product series—the M66S6x serializer chips and the M65D6x/M65Q6x deserializer chips—have sailed through rigorous assessments, including functional safety evaluations and documentation reviews. Those chip products have received ISO 26262:2018 certification, confirming that these products meet the ASIL B functional safety level, according to NEVC.
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