Xingsen Technology's FCBGA Package Substrate Project Enters Market Expansion and Small-Batch Production Phase

Published: Apr 30, 2025 11:43

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["The reference vocabulary is as follows: {}", "Xingsen Technology: FCBGA Package Substrate Project is Currently in the Market Expansion and Small-Batch Production Phase"]
Xingsen Technology stated on the Shenzhen Stock Exchange Interactive Platform that the company's FCBGA package substrate project is currently in the market expansion and small-batch production phase. In the later stage, the company will initiate capacity expansion in a timely manner based on market demand. Additionally, the company indicated that the yield rate of FCBGA package substrates is continuously improving, and the testing work for FCBGA package substrates with over 20 layers is progressing in an orderly manner.

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