Intel Unveils Second-Generation AI-Enhanced SDVSoC and Cabin-Drive Fusion Platform at Shanghai Auto Show

Published: Apr 24, 2025 11:57

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Intel Unveiled the Next-Generation System-on-Chip (SoC) at the Shanghai Auto Show

Intel made its debut at the Shanghai Auto Show, launching the second-generation AI-enhanced Software-Defined Vehicle System-on-Chip (SDVSoC). This SoC is the first in the automotive industry to adopt a chiplet-based architecture, offering up to a 10x improvement in generative and multimodal AI performance compared to its predecessor. Additionally, Intel, in collaboration with Black Sesame Technologies, introduced the Cabin-Drive Fusion Platform, and jointly developed the native intelligent cockpit with Facewall Intelligence.

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