Intel unveiled its next-generation system-on-chip (SoC) at the Shanghai Auto Show. This marked Intel's first participation in the Shanghai Auto Show, where it launched the second-generation AI-enhanced software-defined vehicle system-on-chip (SDVSoC). This SoC is the first in the automotive industry to feature a chiplet-based design, offering up to 10 times the performance in generative and multimodal AI compared to the previous generation. Additionally, Intel, in collaboration with Black Sesame Technologies, introduced a cabin-driving fusion platform, and jointly developed an edge-native intelligent cockpit with Facewall Intelligence. (Jin10 Data APP)