Shanghai (Gasgoo)- On April 15, XPENG held in Hong Kong its first brand launch event targeting global consumers, putting the 2025 XPENG X9 MPV model onto the market and outlining its latest advancements in flying cars and AI robotics. The company reaffirmed its commitment to global expansion through innovation and localized strategies.
The new XPENG X9 comes with four variants, which are priced between 359,800 yuan and 419,800 yuan.
All trim levels are equipped with zero-gravity space seats, with the second-row seats offering first-class-level space comparable to a Boeing 787 and the third row forming a spacious 7.7 m² cabin area.
The MPV also features active rear-wheel steering with a tight 5.4-meter turning radius, dual-chamber air suspension, intelligent damping, and an all-aluminum chassis with six hydraulic bushings for enhanced ride comfort.
Technologically, the XPENG X9 is built on the company's self-developed AI chassis system, capable of scanning road conditions 1,000 times per second and adjusting suspension 200 times per second.
Besides, the new vehicle's entire lineup runs on an 800V high-voltage SiC platform and supports 5C AI-enabled supercharging, enabling over 400 km of range with just 13 minutes of charging.
Safety innovations include a bullet-resistant battery pack that can withstand 890 kN of side pressure, resist impacts of up to 2000 J, and endure temperatures up to 1,000°C, along with a die-cast aluminum body with 46,000 N·m/deg torsional rigidity and 14 active safety features.
The XPENG X9 is expected to enter the European market in the second half of 2025.
Looking beyond new energy vehicles, XPENG outlined its long-term strategy focused on the integration of AI, electrification, and robotics. The company said it has built a full-stack, in-house smart driving R&D system that includes cloud-based foundation models, in-car models, AI chip development, and supporting infrastructure. XPENG is currently training a next-gen 72-billion-parameter model to power its globally adaptive AI driving capabilities.
Central to this ecosystem is the XPENG Turing AI chip, a custom-developed processor tailored for large-model computing. Capable of running a local model with up to 30 billion parameters, it delivers triple the performance of existing chips and will enter production in the Chinese Mainland in the second quarter of 2025. Designed for AI-powered vehicles, robots, and flying cars, it marks the world's first chip capable of supporting all three platforms simultaneously.
XPENG also showcased its pioneering work in the low-altitude mobility sector, which is expected to account for 20% of the overall automobile sales over the next two decades. The company revealed its all-electric flying car, the modular "Land Aircraft Carrier," now on display in Hong Kong. With nearly 4,000-unit pre-orders already received, mass production is targeted for 2026. Its dedicated flying car factory—the world's first with true assembly line capacity—is expected to deliver up to 10,000 units annually.
In the AI robotics space, XPENG introduced IRON, a humanoid robot five years in development. Built at a 1:1 scale, IRON features 22 active degrees of freedom in its hands, is powered by the Turing chip, and leverages end-to-end foundation models and reinforcement learning. It is already in trial operation at XPENG's Guangzhou factory and will be deployed in manufacturing and retail environments to enhance efficiency and customer experience.
