Shanghai (Gasgoo)- On April 10, Bosch Semiconductors and SemiDrive announced an expanded strategic collaboration to advance core technologies in automotive semiconductors.
The partnership aims to integrate Bosch's globally recognized semiconductor IP, reference designs, and software solutions with SemiDrive's domestic chip development capabilities to support the intelligent transformation of China's automotive industry.
During the signing ceremony, Andreas Koenig, Director of IP Products and Technologies at Bosch Automotive semiconductors, remarked that SemiDrive represents a leading force in China's chip innovation. He emphasized Bosch's commitment to open collaboration and highlighted the potential of combining its more than 30 years of expertise in CAN communication technology and GTM modules with SemiDrive's design strengths. This integration is expected to deliver a comprehensive "chip + IP + software" solution, significantly reducing development cycles and costs while enhancing product value for automakers.
The upgraded partnership will focus on three key areas:
IP integration innovation: Bosch's latest CAN IP and GTM modules will be incorporated into SemiDrive's upcoming E3 series products, co-developing high-performance, high-reliability automotive control MCUs.
System-level solutions: The integration of Bosch’s ASIL-D grade PMIC power management technology with SemiDrive SoCs will address the growing demands of intelligent cockpit applications.
Software ecosystem development: ETAS, a Bosch subsidiary, will provide AutoSAR and HSM solutions to enhance functional safety ecosystems across SemiDrive's full range of SoCs and MCUs.
As automotive EE (electrical/electronic) architectures rapidly evolve from distributed systems to domain controllers and centralized computing, Bosch emphasized the need for an open, collaborative, and mutually beneficial technology ecosystem. SemiDrive has already built a robust global network of over 200 ecosystem partners, covering operating systems, virtualization, development tools, protocol stacks, and HMI platforms. The company has achieved notable mass production success in smart cockpit and vehicle control applications, with over 8 million chips shipped across more than 100 mainstream vehicle models.
CAN communication technology has been a global standard in vehicle networking for over three decades. As a pioneer in semiconductor IP, Bosch continues to lead with solutions like M_CAN, X_CAN, and XS_CAN—supporting classic CAN, CAN FD, and next-gen CAN XL protocols—to meet the growing demands of high-speed, reliable data transmission in intelligent connected vehicles.
Additionally, Bosch's GTM IP (Generic Timer Module) serves as a highly integrated co-processor designed for modern automotive electronics and industrial control systems. Known for its precision, configurability, and powerful parallel processing capabilities, GTM is a key enabler in high-performance, real-time control systems.
