Beijing (Gasgoo)- Chinese automotive chip developer SiEngine Technology and FAW Group have inked a domain-fusion chip collaboration agreement and jointly inaugurated the Collaborative Innovation Lab for Onboard Chip Applications at FAW’s technology hub in Changchun, according to SiEngine's announcement on Feb. 21.
The partnership aims to accelerate the application of localized automotive-grade chips in intelligent vehicle solutions and expedite the rollout of next-gen smart cars.
In 2021, SiEngine launched China's first 7nm automotive-grade smart cockpit chip, the SE1000. In 2024, it introduced the 7nm StarLight all-scenario autonomous driving chip, which is slated for mass production in 2025 and deployment in vehicles by 2026.
The new lab builds on FAW's existing adoption of the SE1000 in its Hongqi Jiuzhang intelligent platform. A flagship Hongqi new energy vehicle model featuring the chip will debut in March, while both parties will expand collaboration around the StarLight for autonomous driving systems.
The partners have initiated multiple R&D projects leveraging the two chips, focusing on controller hardware optimization, software co-development, and seamless system integration. Through joint debugging, they aim to refine product performance and user experience. Beyond hardware-software synergy, the alliance will drive ecosystem partnerships to deliver competitive smart mobility solutions.
