Beijing (Gasgoo)- Chinese automotive chip design company SENASIC recently announced the successful completion of its D+ round financing. The round, finalized in July and November 2024, will fuel SENASIC's ongoing technology upgrades.
Founded in 2015, SENASIC specializes in the R&D, design, and sales of high-performance automotive-grade chips. It is one of the few domestic fabless companies engaged in functional safety sensor chip design. SENASIC's product portfolio spans six major lines, including battery pack monitoring, tire pressure monitoring, general sensors/interfaces, in-vehicle wireless transmission, sensor control, and power management. The company has shipped over 100 million chips to date.
The successful D+ financing and corporate restructuring mark a critical milestone in SENASIC's growth. Looking ahead, SENASIC plans to deepen its expertise in chip technology and leverage its investors' resources in the automotive sector. The company aims to launch a range of automotive-grade and industrial-grade smart sensor chips to address the increasing demand for integrated, wireless, and platform-based solutions across automotive, energy storage, and industrial sectors.
