Debon Technology Eyes Expansion: Plans to Acquire 53% Stake in Hengsuo Huawei for Electronic Packaging Material Diversification

Published: Sep 20, 2024 17:50

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[Debon Technology: Plans to Acquire 53% of Hengsuo Huawei's Equity to Expand Electronic Packaging Material Product Categories] SMM News on September 20, Debon Technology announced in the evening that the company had signed a letter of intent for acquisition with the existing shareholders of Hengsuo Huawei Electronics Co., Ltd. (hereinafter referred to as "Hengsuo Huawei"), Zhejiang Yongli Industrial Group Co., Ltd. and Hangzhou Shuhui Industrial Co., Ltd. The company plans to acquire 53% of Hengsuo Huawei's equity through cash and obtain control of Hengsuo Huawei. The initial negotiation price for 100% of Hengsuo Huawei's equity is between 1.4 billion yuan and 1.6 billion yuan. Hengsuo Huawei is primarily engaged in the research and development, production, and sales of epoxy molding compounds, which are primarily used in the field of semiconductor integrated circuit packaging. This acquisition will help expand the company's electronic packaging material product categories, expand its business areas, and open up new growth points for the company.

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