NVIDIA and AMD are reportedly booking TSMC's advanced packaging capaci

Published: May 6, 2024 10:04

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NVIDIA and AMD are reportedly booking TSMC's advanced packaging capacity for this year and next. AI giants NVIDIA and AMD are fully committed to sprinting into the high-performance computing (HPC) market, reportedly booking TSMC's advanced packaging capacity for CoWoS and SoIC for this year and next. TSMC is highly optimistic about the momentum brought by AI-related applications. During the April conference, President Wei Zhejia revised the visibility and revenue proportion of AI orders, extending the order visibility from the original expectation of 2027 to 2028. TSMC believes that the revenue contribution of server AI processors will grow more than double this year, accounting for a low percentage of the company's total revenue in 2024. It is expected that the compound annual growth rate of server AI processors will reach 50% in the next five years, accounting for more than 20% of TSMC's revenue in 2028. (Taiwan Economic News)

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