SHANGHAI, Feb 17 (SMM) - According to Dow Jones Newswires, Infineon Technology said on Thursday that it would invest 2 billion euros (about $2.27 billion) to improve its manufacturing capability in broadband semiconductors. The German chipmaker said it would build a third module at its plant in Kulim, Malaysia, to significantly increase its output and that the new module would generate 2 billion euros income annually in addition once completed. The construction will begin in June and the first batch of wafer will be rolled off in the second half of 2024. Infineon also indicated that in the next few years, it will transform the silicon semiconductor facilities at the Villach plant in Austria into broadband facilities.