NXP strong Core New Generation artificial Intelligence Internet of things and Automotive Electronic Chip Project officially landed in Tianda Science and Technology Park

On January 26, Teda Science and Technology Park held a signing ceremony with NXP Qiangxin (Tianjin) IC Design Co., Ltd. (referred to as "NXP Qiangxin"). The new generation of artificial intelligence Internet of things and automotive electronic chip project of NXP Qiangxin officially landed in Tianda Science and Technology Park of Tianjin Economic Development District.

After the landing of the project, more high-end artificial intelligence Internet of things and automotive electronic products will be introduced into Tianjin Economic Development District to carry out localized design. NXP strong core chip design and system application, product development and packaging and testing capabilities will achieve a perfect combination, in the field of artificial intelligence Internet of things and automotive electronic chips, to create the world's leading industry-wide chain integrating R & D, production and application.

Teda news from Tianjin Economic Development District shows that the Tianda Science and Technology Park, where the NXP strong core project landed this time, was established by the Economic Development District Management Committee in cooperation with Tianjin University. It is one of the first batch of 15 pilot units for the construction of national university science and technology parks determined by the Ministry of Science and Technology and the Ministry of Education.

According to reports, NXP Qiangxin (Tianjin) IC Design Co., Ltd. was established in Tianjin Economic and technological Development area in September 2002. It is China's first cooperative enterprise with multinational corporations in the core field of integrated circuit design. It is one of the most important R & D centers of NXP Semiconductor in China. The company is deeply engaged in the development of embedded microcontroller (MCU) and microprocessor (MPU) products, and has international leading SoC full-flow design capabilities, digital and analog IP development capabilities, security password IP development and integration capabilities. At present, the product technology has reached the international advanced level of 5 nanometers.