Xiamen Yuntian Semiconductor Phase II project may be put into operation in April.

It is reported that during the Spring Festival, a number of key enterprises and key projects will not stop work. During the Spring Festival, Xiamen Shilan has nearly 2000 workers and management team to stick to the production line.

In addition, in the Yuntian semiconductor wafer-level advanced packaging and passive components production phase I construction project plant, in order to ensure that the second phase of the project can be put into use in April this year, about 60 workers on the site stick to their posts and rush to build the production line during the Spring Festival. According to the person in charge of Yuntian Semiconductor, the second phase of Yuntian Semiconductor Project, located in Haicang Semiconductor Industry Base, is a key investment project in the city. after it is completed and put into use, the company will have a full range of wafer-level packaging capabilities from 4 inches, 6 inches to 8 inches and 12 inches.

Yuntian Semiconductor was founded in July 2018, the company is committed to 5G RF device packaging and integration technology, the main business includes filter wafer-level 3D packaging, high-frequency millimeter wave chip integration, RF module integration, IPD passive component design and manufacturing, and Bumping/WLCSP/TGV technology, providing customers with full-process R & D solutions and services from product collaborative design, process R & D to mass production. The first phase of the factory is located in Haicang District, Xiamen, with a construction area of 4500 square meters, with a 4-inch and 6-inch WLP production capacity of 8000 pieces per month, and has now been put into mass production.