The demand for HPC chips drives the rapid expansion of large-size ABF carrier plates.

Industry sources said that as chipmakers continue to expand production of large-size HPC chips, IC substrate manufacturers are stepping up efforts to expand the capacity of large-area ABF boards needed to process such chips.

After completing the expansion, Xinxing Electronics is looking for new land to further expand its production capacity, the Electronic Times reported. Their local counterparts, South Asia circuit boards and Jingshuo Technologies, are also increasing capital spending to support new capacity expansion plans in 2022, according to sources. Ibiden and Shinko, in Japan and Semco and LG Innotek in South Korea are also busy deploying more ABF board production lines.

According to sources, these manufacturers are expected to further increase capital investment in 2022, not only to increase production capacity, but also to upgrade technology to better meet customer needs. It added that for HPC chips with more and more complex designs and more and more functions, there is an urgent need for ABF carrier boards with larger area size and higher layers.