The equipment of Xi'an Yi Siwei project has been put in place and began to be sold at full capacity.

On the morning of July 30, Xi'an High-tech Zone held a forum on "Enterprise through train service for thousands of miles" and "pro-business to help enterprises". Many enterprises from the industrial chain of high-end equipment, new materials and new energy, electronic information, hard technology, automobile and so on are invited to attend the meeting.

According to the Xi'an High-tech Zone Management Committee, at the meeting, the general manager of Xi'an Yi Si Wei Company said that Xi'an Yi Si Wei project equipment has been in place and began to sell at full production.

The general manager of Xi'an Yiswei Company said that the overall progress of the construction and development of the Yiswei project is very smooth, which is inseparable from the help and strong support of Shaanxi Province, Xi'an City and Xi'an High-tech Zone. In the near future, Xi'an Yiwei will become the number one silicon wafer company in China.

As for how to achieve high-quality development of the semiconductor industry in Xi'an High-tech Zone, he suggested that Xi'an High-tech Zone should strengthen support for power and other supporting aspects of manufacturing enterprises, and introduce more policies on the introduction of high-end talents and foreign talents. At the same time, we can increase and guide enterprises that are currently doing semiconductor-related business or interested in developing semiconductor-related business to open up the upstream and downstream industrial chain, and jointly strengthen the semiconductor industry of Xi'an High-tech Zone, so as to achieve higher-quality development.

Yixiwei material is one of the few semiconductor material enterprises in China that produce 12-inch silicon wafers with energy. Yi Si Wei material Xi'an first factory design capacity of 500000 pieces / month. The products are polished wafers and epitaxial wafers, which are mainly used in logic chip (Logic), flash memory chip (3D NAND & Nor Flash)), dynamic random memory chip (DRAM), image sensor (CIS), display driver chip (Display Driver IC) and so on.