Under the background of the continuous shortage of foundry production capacity, the major manufacturers are ferocious to expand production. As the biggest expenditure in the expansion plan, semiconductor equipment has become a "hot cake", but the manufacturers in this link are also in the plight of material shortage.
According to a report in the Japanese Daily Industry News on July 30, a senior official of a large chip factory said that due to a shortage of parts (it is impossible to determine which kind of parts), the delivery time of semiconductor equipment has been extended from the original year to a year and a half. "in the future, we must evaluate the factors for the extension of the delivery period to formulate a plan to increase production in the factory."
The situation of equipment research and development and delivery delay has been confirmed by domestic and foreign manufacturers. According to foreign media reports, the global chip testing equipment leader Edwin (Advantest) 's test equipment for the procurement of chips is becoming more and more difficult, the test equipment delivery time is usually 3-4 months, but now it has been extended to about 6 months. "there is a shortage of materials that we have never seen before," said Fumi Yoshida, president and CEO of Edwin testing.
Prior to this, on March 19, the domestic semiconductor equipment manufacturer Core Source announced that some of the imported equipment and materials needed for its "high-end wafer processing equipment R & D center project" could not be supplied normally and in a timely manner. The equipment procurement, installation and commissioning of the project have been delayed, and the R & D project is not as good as expected. The company plans to adjust the scheduled availability time of the project to March 31, 2022.
The shortage of spare parts is mainly caused by the sharp extension of the purchasing cycle.
According to previous reports on Jiwei, industry insiders said that originally, wafer factories have reserved space, and they can expand production capacity by adding some equipment to the production line, but now they are "unable to buy" equipment, so production capacity cannot be expanded rapidly. The "inability to buy" expressed by the above-mentioned industry insiders is not import restrictions, but a substantial extension of the procurement cycle. Orders from equipment manufacturers in Japan, Europe and the United States are soaring and cannot be shipped in time at all.
The reasons for the delayed delivery of semiconductor equipment include limited logistics operation, shortage of parts and components, shutdown restrictions and so on, among which the shortage of parts is the most "fatal".
According to a report by the Nikkei News on June 22, according to a survey conducted by Japanese metal processing intermediary Caddi on 32 semiconductor manufacturing equipment manufacturers participating in the Caddi seminar, about 60% of them have faced the problem of insufficient supply of parts in the past year, and more than 70% said they had faced problems such as procurement delivery, price, quality, and so on.
Caddi pointed out that with the rising demand for chips, in order to make up for the continuing shortage of parts supply, more and more semiconductor equipment manufacturers are eager to find new parts suppliers.
Multi-point blooming of domestic semiconductor equipment companies is expected to welcome Davis' double-click.
AVIC Securities recently released a research report saying that the localization rate of semiconductor equipment in China is still low. However, under the potential threat of extended delivery and interruption of supply of foreign semiconductor equipment, wafer factories have greatly increased their enthusiasm and autonomy in accelerating the introduction of domestic equipment.
Recently, the bidding speed of local wafer factories has been accelerated. According to the statistics of CNAC Securities, from the result of winning the bid, in the equipment of degumming, CVD, PVD, CMP, heat treatment, etching and cleaning, domestic semiconductor manufacturers have recently obtained a number of equipment orders, including 2 CVD, 1 PVD, 28 heat treatment and 1 cleaning, 13 degumming, 2 heat treatment and 2 cleaning equipment in Yitang, 1 etching in micro and 3 CMP, in Huahai Qingke. Core source micro-winning bid 3 cleaning equipment.
Analysts at the agency said that according to the pace and progress of past tenders, a large number of equipment tenders are expected to be invited in the second half of the year. In the context of the explosion of equipment demand and the improvement of the localization rate, local semiconductor equipment companies are expected to usher in the double-click of Davis to achieve a double increase in profitability and valuation.
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