SMIC Shaoxing will join hands with the teams of Xijiaotong University and Xidian to start the second phase of the project with a planned investment of 16 billion yuan.

Recently, the management committee of Shaoxing Binhai New area issued a reply letter on proposal No. 40 of the Fifth session of the eighth Municipal Committee of the Chinese people's political Consultative Conference (CPPCC). It mentions the developments of SMIC, Changdian Technology, Haowei (Weier) and other projects that have been introduced into the new industrial platform of Shaoxing integrated circuit "ten thousand mu 100 billion".

(1) SMIC Shaoxing project: as the first landmark project to be put into production in the platform, SMIC Shaoxing's current production capacity has climbed to 50, 000 pieces per month, with an output value of nearly 1 billion yuan in 2020. In the next step, on the basis of the first phase of high quality, we will invest 6.13 billion yuan and implement the project to expand production. The production capacity will be increased to 100000 pieces per month; At the same time, together with the wide band gap semiconductor research team of Xi'an Jiaotong University and Xi'an University of Electronic Science and Technology, the second phase 6-inch compound device wafer manufacturing and 8-inch characteristic process production line project with a planned investment of 16 billion yuan is launched.

(2) Changdian Shaoxing project: Changdian Shaoxing project took the land on May 13, 2020 and was granted a construction permit on June 4, setting a new record of 22 days from land acquisition to construction. The roof of the main factory building will be completed in August 2021 and will be put into production by the end of the year.

(3) Velhaowei project: the pilot project, Shaoxing Weihao Company, will achieve an output value of 1.28 billion yuan in 2020. The lower reaches of the industry chain has started its testing and reconfiguration packaging project at the end of August 2020, and plans to achieve mass production by the end of 2021.

(4) other key projects: with an investment of nearly 10 billion yuan, the first phase of the first phase of the cross-strait integrated circuit innovation industrial park officially started construction on September 11, 2020; the most advanced target technology in Japan, China, Japan and South Korea high-end semiconductor materials industrial park project laid the foundation on October 15, 2020, and plans to put into production in the fourth quarter of this year.

In order to strengthen the protection and build the industrial ecology in all aspects, in August 2020, the integrated circuit industry fund of Shaoxing Binhai New area was set up with a subscription scale of 10 billion yuan, which specially supported SMIC, Changdian, Howwei, Meixin and other high-quality projects. In 2020, the urban two-tier industrial fund has contributed more than 4.5 billion yuan, while it has also attracted 1.28 billion yuan from provincial funds and 2.08 billion yuan from the national big fund. Work together to promote the establishment platform of the Shaoxing campus of Hangzhou University of Electronic Science and Technology, the first integrated circuit science and engineering college in the province. Hangzhou Electric Power Shaoxing Campus has a total investment of 2 billion yuan, covers an area of 500mu and has more than 500teachers. It will be introduced into Hangdian's integrated circuit undergraduate, master, doctor and post-doctoral training system, and plans to recruit and train 2000 undergraduates, 2000 masters and 500doctors. we will strive to complete the land supply by September this year and formally put it into use in the first half of 2024.