Chengdu Yuxin Phase III project will add 5.63 billion new integrated circuit package and test products per year.

On July 2, the groundbreaking ceremony of the third phase of Yuxin (Chengdu) Integrated Circuit Packaging and testing Co., Ltd. (hereinafter referred to as "Yuxin") was held in Chengdu High-tech Comprehensive Protection Zone. The project, which will be completed in September 2022 and put into use by the end of the year, will further enhance the production capacity of integrated circuit packaging and testing and chip bump processing.

The Yuxin Phase III project, which laid the foundation, adopted advanced technologies such as square flat pin-less package (QFN), wafer-level chip scale package (WLCSP), grid array package (LGA), microsystem package (MEMS), spherical pin grid array package (BGA) and so on. After the third phase of the project is completed and put into use, Yuxin will increase the production capacity of 5.63 billion integrated circuit packaging and testing products and 180000 chip bumps per year, which will form a production scale of 9.7772 billion integrated circuit packaging and testing products and 540000 chip bumps per year, and the total production capacity will be more than doubled.

According to reports, Yuxin is the second largest semiconductor packaging and testing company in Malaysia-- Younison (UNISEM), which invested 330 million US dollars and has the most advanced chip packaging and testing equipment in the world. It mainly produces BGA, SLP and other high-end products, which are widely used in communications, communications, industrial products, and automotive industries. It is of great significance to the development of IT industry and the building of an electronic information industry base dominated by microelectronics.

Up to now, nearly 40 enterprises have settled in the Chengdu Hi-tech Comprehensive Insurance Zone, gathering high-end manufacturing companies such as Intel, Texas Instruments, Dell, and Morse connectors to form a relatively complete integrated circuit industry chain composed of IC design, wafer manufacturing, packaging testing, and supporting projects. at the same time, Apple, Dell's tablets and laptops and other intelligent terminal products are also produced here. It has become an important production base for tablets and laptops all over the world.