TSMC Arizona plant will install equipment from the middle of next year

Published: Jun 22, 2021 11:56
[TSMC Arizona plant will install equipment from the middle of next year] according to industry sources, TSMC is expected to start equipment installation at the 5nm advanced process plant in Arizona as early as mid-2022. Fuji Mai Semiconductor (Foxsemicon Integrated Technology), Fan Xuan system Technology (Marketech International), Hantang Integrated (United Integrated Services,UIS) are all equipment suppliers of the factory.

According to industry sources, TSMC is expected to start the installation of equipment at the 5nm advanced process plant in Arizona as early as mid-2022.

Citing the above sources, Fuji Mai Semiconductor (Foxsemicon Integrated Technology), Fan Xuan system Technology (Marketech International), Hantang Integrated (United Integrated Services,UIS) are all equipment suppliers of the factory.

Among them, clean room builder Hantang Integration will soon send hundreds of engineers to Arizona to participate in the construction of the fab; Fan Xuan Systems Technology, as ASML's EUV module production partner, will also send a team of engineers to the plant, which is expected to start confirming the order revenue of the new plant in the third quarter of 2022.

Both Hantang Integration and Fan Xuan Systems Technology have been TSMC's long-time partners, and they have also reportedly won orders for the expansion of TSMC's 5nm and 3nm advanced process plants in southern Taiwan.

Foxconn subsidiary Foxconn Semiconductor is a new equipment supplier whose revenue, as a partner in applied materials, will be boosted by new factory orders in 2022 and 2023.

Wei Zhe-Jia, CEO of TSMC, previously said that by 2023, TSMC will expand factory capacity, especially advanced process capacity, with a total investment of US $100 billion.

In addition to breaking ground at the Arizona plant, TSMC recently began building new 5nm and 3nm advanced process facilities at its factories in southern Taiwan. At the same time, there are plans to build a new plant in the Hsinchu Science and Technology Park (HSP) for 2nm manufacturing, and land is currently being acquired.

In addition, TSMC is building an advanced packaging plant in Chunan, northern Taiwan, and expects to commercialize SoIC technology there in the second half of 2022.

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