Samsung's second phase of high-end memory chips is expected to be mass produced in the second half

In Xi'an High-tech Zone, the second phase of Samsung memory chip project, which invested 15 billion US dollars, is about to enter the stage of mass production.

With the construction and production of Samsung Phase II, Samsung (China) Semiconductor will further strengthen its position as a global semiconductor production base.

According to reports, Huang Hesub, chairman of Samsung (China) Semiconductor Co., Ltd., said that as a key construction project in Shaanxi Province, the second phase of Samsung's high-end memory chip is progressing smoothly and is currently in the final stage of equipment installation and commissioning. Mass production is expected in the second half of this year. On the basis of Samsung's investment of US $11 billion in the first phase of Samsung's high-end memory chip project and the package test project, Samsung has invested an additional US $15 billion in the second phase of the memory chip project, with a cumulative investment of US $26 billion.

On August 30, 2017, Samsung Electronics Co., Ltd. signed an investment cooperation agreement with the Shaanxi provincial government and decided to build the second phase of Samsung (China) Semiconductor Co., Ltd. memory chip project in Xi'an High-tech Comprehensive Free Trade Zone.

The first phase of the second phase of Samsung's high-end memory chip project invested about 7 billion US dollars, and the launch ceremony of the first phase of the second phase of the project was held on March 10, 2020. The second phase of the project, with an investment of 8 billion US dollars, was officially launched on December 10, 2019.