Gree publishes the patent of "Heat dissipation structure and installation method based on Power Semiconductor Devices"

Recently, Zhuhai Gree Electric Appliances Co., Ltd. (hereinafter referred to as: Gree Electric Appliances) added a number of patent information, including "heat dissipation structure and installation method based on power semiconductor devices" patent, which has been granted.

The applicant for the patent also includes Zhuhai Zero Border Integrated Circuit Co., Ltd.

According to the patent summary, the heat dissipation structure comprises a power semiconductor device, a circuit board, an insulating layer, a radiator and a fixed assembly; at least two openings are arranged on the circuit board, and at least two fixed components are arranged in the at least two openings; one end of the fixed assembly is extended to one side of the circuit board, and the epitaxial part of at least two fixed components clamps the fixed power semiconductor device. The epitaxial part of the fixing assembly is also embedded on a surface of the radiator to fix the power semiconductor device through the circuit board and the radiator; the insulating layer contact is arranged between the power semiconductor device and the radiator.

In this way, by clamping and fixing the power semiconductor device on one side of the circuit board, the heat dissipation area is increased, which is beneficial to the heat dissipation of the power semiconductor device, and the burning of the power semiconductor device or the circuit board due to leakage is avoided.