Global 200nm fab production capacity will increase by 17% to 6.6 million tablets per month from SEMI:2020 year to 2024.

According to SEMI China, the latest report released by SEMI shows that global semiconductor manufacturers are expected to increase 200mm fab capacity by 17% from 2020 to 2024, reaching an all-time high of 6.6 million wafers per month.

Ajit Manocha, President and CEO of SEMI, said: "200mm Fab Outlook Report shows that in the same period, wafer manufacturers will add 22 new 200mm fab plants to help meet the growing demand for 5G, automotive and Internet of things (IoT) devices, which rely on analog, power management and display drivers that integrate IC, MOSFET, microcontroller unit (MCU) and sensors."

According to the report, foundry will account for more than 50 per cent of global fab capacity this year, followed by analog at 17 per cent and discrete / power at 10 per cent. In 2021, China will lead the world in terms of 200mm production capacity, with a market share of 18 per cent, followed by Japan and Taiwan with 16 per cent respectively.

In addition, the report points out that global 200nm fab equipment spending will break through the $3 billion mark in 2020 and is expected to reach nearly $4 billion in 2021.