Miao Xiang, an engineer in the Infrastructure Engineering Department of Changdian Integrated Circuit (Shaoxing) Co., Ltd., said that after reaching production, our production capacity in the first stage is a mid-road high-density package (product) with an annual output of 100000 pieces of 300mm, which is the first high-density packaging production line in China. fill the domestic gap, the annual output value can achieve 3.8 billion yuan after full production.
On June 3, 2020, the groundbreaking ceremony was held for the 300mm integrated circuit advanced packaging production line project of Changdian Integrated Circuit (Shaoxing) Co., Ltd.
Prior to the release of news in Yuecheng, the first phase of the project has a total planned area of 230mu and can form a 12-inch wafer-level advanced package with an annual production capacity of 480000 pieces. The second phase has a total planning area of 150 mu, with high-end packaging products as the direction of R & D and construction, to create a world-class advanced packaging production line.
In addition, SMIC Shaoxing project, which is invested by SMIC, which is the leader of chip manufacturing, has been in mass production, with an output value of nearly 1 billion yuan in 2020.
In recent years, Shaoxing aims at the integrated circuit industry, a strategic emerging industry, and makes every effort to hit the "core" brand. In 2020, the output value of the integrated circuit industry will increase to 30 billion. Changdian Shaoxing and SMIC Shaoxing are two important projects located in Shaoxing. According to the latest report from Zhejiang Voice, the first phase of the advanced packaging project in Shaoxing, with an investment of 8 billion yuan, took only 22 days to start construction, and will be put into production by the end of this year.
