The total investment is 600 million yuan! Huajin Semiconductor Phase II Advanced Packaging Project starts

According to the official website of Huajin Semiconductor, on the afternoon of December 25, 2020, under the concern of the party and government leaders of the state and Jiangsu Province, Wuxi City, Xinwu District and the company's shareholders, Huajin Semiconductor Packaging pilot Technology Research and Development Center Co., Ltd. held the opening ceremony of Huajin Phase II and the signing ceremony of the advanced packaging material verification laboratory project.

Yu Shengkang, chairman of Huajin Semiconductor, said that the signing of the National Integrated Circuit characteristic process and package Test Innovation Center and the Advanced Packaging material Verification Laboratory built by Huajin Phase II is an important measure to realize Huajin's development strategy. Huajin is determined to become an international first-class R & D center and technology conversion platform, which will bring new development opportunities for Huajin. It will also further consolidate the leading advantages of Jiangsu Province and Wuxi in the field of closed testing of integrated circuits in China, and contribute to strengthening the strength of the closed testing industry in Jiangsu and Wuxi.

Ye Tianchun, president of the Integrated Circuit Innovation Research Institute (chip) of the Chinese Academy of Sciences, congratulated Huajin on the start of the second phase and said that Huajin has become an important platform for the semiconductor industry in Xinwu District of Wuxi City, forming a certain first-mover advantage. Huajin has established its own brand and influence, which plays a key role in promoting the coordinated development of China's semiconductor industry and forming a future packaging technology system. The construction of the second phase is not only a milestone in the development of Huajin Company, but also shows Huajin's confidence and determination to achieve high-quality development.

Jiang Min, vice mayor of Wuxi and secretary of Xinwu District Party Committee, congratulated China on the second phase of construction and looked forward to the joint construction of advanced packaging materials verification laboratory. She said that Huajin, as a key enterprise in Wuxi High-tech Zone, has maintained a good development trend and strong development potential over the years. Wuxi High-tech Zone will take this project construction and contract signing as an opportunity to further deepen cooperation, improve services, and strive to lead and demonstrate the implementation of the Taihu Lake Bay Branch Belt and Innovation Strategy with a better innovation ecology and entrepreneurial environment.

On behalf of Wuxi National High-tech Industrial Development Zone Management Committee, Zhu Xiaohong, deputy head of Xinwu District, signed a contract with Cao Liqiang, general manager of Huajin Semiconductor Packaging pilot Technology Research and Development Center Co., Ltd., to jointly build an advanced packaging material verification laboratory.

In a warm atmosphere, Huang Qin, secretary of the Wuxi Municipal CPC Committee in Jiangsu Province, announced the official start of the second phase of the Huajin project, and everyone witnessed this glorious moment with blessings and expectations. The successful holding of the opening ceremony and the signing ceremony marks a key step in the construction of the project, and it will certainly become a beautiful new business card for Huajin in the future.

As an important part of the construction of the National Integrated Circuit characteristic process and package testing Innovation Center, Huajin Phase II "Advanced Packaging and system Integration upgrade and renovation Project for Annual Packaging and testing of 25 million Semiconductor products". Committed to the realization of self-controlled packaging and testing of domestic high-performance ASIC chips, based on the national R & D platform of advanced packaging / system integration, Develop 3D system integrated packaging and related advanced packaging technology.

The construction land of the project is about 24 mu, of which the construction area of factory building, scientific research office building, supporting power plant and storage building is about 25000 square meters, with a total investment of 600 million yuan. After the completion of the project, it will provide wire bonding solder ball array packaging for automotive electronics, consumer electronics and communication products, and flip chip solder ball array packaging and flip chip size packaging for processor chips, high-bandwidth network servers, communication chips, RF chips, memories, etc. Based on a comprehensive study of the development direction of integrated circuit packaging technology, the second phase of Huajin will focus on three technologies: Damascus silicon adapter technology for artificial intelligence (AI) / high performance computing (HPC) applications, wafer level packaging technology for Internet of things IOT and consumer electronic products. And FCBGA packaging technology for CPU (CPU), graphics processor (GPU) and application-specific integrated circuit (ASIC).

Through the construction of the second phase of Huajin, Huajin will further enrich and improve the intellectual property system based on independent innovation technology, and the overall technological level will enter the forefront of the world; further give full play to the collaborative innovation model of the industrial chain, combined with the product needs of design and system enterprises, strengthen the cooperation between the upper and lower reaches of the industrial chain, and promote the mass production application and industrialization promotion of high-end packaging technology. Further promote the research and development of the whole industry chain of high-end IC products, establish a sustainable industrial development model through original technological innovation, and provide a complete set of advanced solutions for the technological upgrading of the domestic closed test industry. (China Total Solution), promotes the development of semiconductor closed test industry chain and value chain with Chinese characteristics.

The advanced packaging material verification laboratory jointly established by Wuxi National High-tech Industrial Development Zone Management Committee and Huajin Semiconductor Packaging pilot Technology Research and Development Center Co., Ltd., based on the demand of integrated circuit packaging materials of domestic application leading companies, the key performance of advanced packaging materials is evaluated, verified, debugged and optimized, and the direction of material improvement is provided for advanced packaging materials manufacturers. Make the performance of the key materials of advanced packaging meet the process, reliability and mass production requirements of advanced packaging FCCSP, FCBGA, wafer-level fan-out package (Fan-out) and 2.5D/3D. Through the study of the packaging process, various packaging process parameters such as warping, gap filling, bump protection and fluidity defects are explored from the process end to ensure the overall matching of the packaging material and the packaging process. From the point of view of coordinated joint research and development of formula and process, it finally meets the overall requirements of electronic packaging materials.

After the completion of the advanced packaging material verification laboratory, it will strive to fill the lack of coupling links between key advanced packaging materials and processes in China's integrated circuit closed testing industry chain under the domestic and international double cycle pattern; efforts will be made to link up material development, process application and integrated circuit products, promote the improvement of material technology system and industrialization level, and form the international competitiveness of advanced packaging material technology and industry. Aiming at supporting controllable materials at the application end, we will carry out rapid evaluation, verification and rapid industrialization of the core limited materials for integrated circuit closed testing, so as to achieve the goal of independent and controllable development of China's leading integrated circuit enterprises.

According to SkyEye, Huajin Semiconductor is a semiconductor packaging pilot technology developer, through system-level packaging / integration pilot technology research, research and development of 2.5D/3D TSV interconnection and integration key technologies (including TSV manufacturing, bump manufacturing, TSV backexposure, chip stacking, etc.), to provide system solutions for the industry. At the same time, we will carry out the research and development of a variety of wafer-level high-density packaging processes and SiP product applications, as well as the verification and research and development of materials and equipment related to packaging technology.

Huajin Semiconductor has gone through several rounds of financing, investors include China Science and Technology Union, Chinese Academy of Sciences Microelectronics, Changdian Technology, Jingfang Technology, Huatian Technology, Xingsen Technology, Shennan Circuit, Guokai Development Fund, Tongfu Micropower, Xinchao Group and Huada Microelectronics.